TFDS-842 – COMPACT SPUTTERING SYSTEMS

Next generation sputtering deposition systems series TFDS-840, 842 are flexible completely customizable magnetron sputtering systems designed specifically for R&D and prototype production. Multi-gun capability, co-sputtering, sequential sputtering without breaking vacuum and reactive sputtering (with active gas mixtures) are possible.

TFDS-842 is the most compact sputtering system with minimal footprint, while TDFS-840 is a compact-configuration with a load-lock chamber.

Features:

Electro-polished stainless-steel chamber (D shaped Box)
4” Diameter viewport on front door with manual shutter
Additional spare ports/ flanges for future upgrades
Dry scroll pump (per request – dual stage rotary vane pump)
Cryo pumping or turbo-molecular vacuum pumping system
Cold-cathode or hot cathode ionization gauge
Throttle gate-valve

Load-lock with:

Manual/automatic sample transfer system
UV cleaning
Controlled oxygen inlet
Sample rotation
Sample controlled heating/cooling
Pneumatically operated gate-valve
Turbo-molecular pumping-system
Single/multiple magnetron gun assemblies with various target sizes
The stand-alone guns with special mounting enable angular and high adjustment
Targets are indirect cooled
Cooling water is not in contact with the magnets or with applied cathode power
DC / RF sputtering deposition of magnetic, non-magnetic metals or insulators
Easy target mounting
DC, DC pulsed, RF or HiPIMS power supplies
Blocked filters for DC power supplies
High-voltage switch box
Motorized shutter assembly for each source
Up to 4-gas inlets with mass flow controllers
Substrate pre-cleaning by Ion-source
Substrate rotation
Substrate heater (from RT up to 800°C)
Programmable adjustable substrate height before or during deposition (Z-shift)
PC /PLC controlled system

TFDS-842 – COMPACT SPUTTERING SYSTEMS

Other Products We Offer

BELL JAR THIN FILM DEPOSITION SYSTEM TFDS-462T

TFDS-840 (With Load Lock)

TFDS-842 (Without Load Lock)

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