TFDS-550C – MULTI-CHAMBER VACUUM CLUSTER
TFDS-550C is a multi-chamber vacuum cluster tool is capable to integrate up to 7 process modules including but not only:
- Load lock/s for loading/unloading
- Metal and organic deposition
- Thermal treatment chambers
- Masks storage chamber
Features:
- Processing of substrates up to 200×200 mm, and larger.
- Fully automated robotic sample transfer system
- Face down design if evaporation is required
- Rectangular gate valves to separate modules from robot chamber
- Totally dry pumping system
- Rotating / positioning substrate holders
- Mask Changing/Storage Module for up to 20 masks
- Base pressure ≤ 5 · 10-7 mbar
- PLC/PC fully automated process control
Deposition Techniques Available:
- Thermal Evaporation, includes RADAK sources
- Electron Beam Evaporation
- Ion Beam Assisted E.B. Evaporation
- Flash Evaporation
- Magnetron Sputtering (RF, DC, Pulsed DC and HIPIMS)
- Organic Evaporation, available with up to 8 Low Temperature Evaporation
- Inductive Coupled Plasma
- Laser Ablation
- Pulsed Laser Deposition
- Ion Beam Sputtering
- Ion Beam Etching
Process Options:
- Heating
- Cooling
- Ion Source Cleaning
- Reactive Plasma Surface Activation
- Reactive Gases Partial Pressure
- Progressive Mask