IMG 7890

ALD 300 – Thermal Atomic Layer Deposition

Compact Atomic Layer Deposition System – Thermal

  • Thermal-based ALD systems
  •  4”-8” wafer holder with substrate heating
  • 2-6 precursors , 2-6 gas lines
  • Flexible design for any purpose, solar-cells, display-panels, semiconductors, MEMS, etc.
  • Special sample design for powder coating
  • PC/PLC Control with Touch-screen HMI
  • Operation modes – manual, automatic, programming
  • Option for glovebox integration