Next generation sputtering deposition systems series TFDS-840, 842 are flexible completely customizable magnetron sputtering systems designed specifically for R&D and prototype production. Multi-gun capability, co-sputtering, sequential sputtering without breaking vacuum and reactive sputtering (with active gas mixtures) are possible.
TFDS-842 is the most compact sputtering system with minimal footprint, while TDFS-840 is a compact-configuration with a load-lock chamber.
Features:
Load-lock with:
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